Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node

ABSTRACT

An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.

FIELD OF THE INVENTION

The present invention relates in general to electronic assemblies. Inparticular, however not exclusively, the present invention concernselectrical nodes for implementing functionality or functionalities inelectronic assemblies including a molded, such as injection molded,plastic material layer.

BACKGROUND

There exists a variety of different stacked assemblies and structures inthe context of electronics and electronic products. The motivationbehind the integration of electronics and related products may be asdiverse as the related use contexts. Relatively often size savings,weight savings, cost savings, or just efficient integration ofcomponents is sought for when the resulting solution ultimately exhibitsa multilayer nature. In turn, the associated use scenarios may relate toproduct packages or food casings, visual design of device housings,wearable electronics, personal electronic devices, displays, detectorsor sensors, vehicle interiors, antennae, labels, vehicle electronics,etc.

Electronics such as electronic components, ICs (integrated circuit), andconductors, may be generally provided onto a substrate element by aplurality of different techniques. For example, ready-made electronicssuch as various surface mount devices (SMD) may be mounted on asubstrate surface that ultimately forms an inner or outer interfacelayer of a multilayer structure. Additionally, technologies fallingunder the term “printed electronics” may be applied to actually produceelectronics directly and additively to the associated substrate. Theterm “printed” refers in this context to various printing techniquescapable of producing electronics/electrical elements from the printedmatter, including but not limited to screen printing, flexography, andinkjet printing, through a substantially additive printing process. Theused substrates may be flexible and printed materials organic, which ishowever, not always the case.

Furthermore, the concept of injection molded structural electronics(IMSE) actually involves building functional devices and parts thereforin the form of a multilayer structure, which encapsulates electronicfunctionality as seamlessly as possible. Characteristic to IMSE is alsothat the electronics is commonly manufactured into a true 3D(non-planar) form in accordance with the 3D models of the overall targetproduct, part or generally design. To achieve desired 3D layout ofelectronics on a 3D substrate and in the associated end product, theelectronics may be still provided on an initially planar substrate, suchas a film, using two dimensional (2D) methods of electronics assembly,whereupon the substrate, already accommodating the electronics, may beformed into a desired three-dimensional, i.e. 3D, shape and subjected toovermolding, for example, by suitable plastic material that covers andembeds the underlying elements such as electronics, thus protecting andpotentially hiding the elements from the environment.

In typical solutions, electrical circuits have been produced on aprinted circuit board (PCB) or a on substrate film, after which theyhave been overmolded by plastic material. Known structures and methodshave, however, some drawbacks, still depending on the associated usescenario. In order to produce an electronic assembly having one or morefunctionalities, typically rather complex electrical circuits forachieving these functionalities have to be produced on a substrate byprinting and/or utilizing SMDs, and then be overmolded by plasticmaterial. However, in the known solutions, the implementation of complexfunctionalities may face reliability risks and assembly yield issuesarising from challenges in integrating very dense components andcomponents with complex geometries. Furthermore, the electronic assemblymay require, for example, the use of external control electronics whichreduces degree of integration and makes the structures less attractive.Directly integrating dense components and components of complex geometrycan be challenging and potentially very risky, as reliability will oftenbe affected by molding pressure, for instance, and the assembly yieldsin different production phases can be very low. Subassemblies mounted orarranged on a PCB and covered with a plastic layer can suffer frommismatch in thermal expansion coefficients, be difficult to beovermolded due to their complex structure, and exhibit stresses in thestructure which can tear the subassemblies off their electricalcontacts. Challenges in thermal management may also generally causeissues such as overheating. Thus, there is still a need to developstructures and methods related to IMSE.

SUMMARY

The objective of the present invention is to at least alleviate one ormore of the above drawbacks associated with the known solutions in thecontext of electronic assemblies utilizing molded or cast structures,and multilayer structures and electronics embedded therein.

The objective is achieved with various embodiments of an electricalnode, a method for manufacturing, an electrical node, related assemblysuch as a node strip or sheet, and a multilayer structure in accordancewith the present invention. Particularly, the objectives are reached byan electrical node, a method for manufacturing of an electrical node, anelectrical node strip or sheet, and a multilayer structure as defined bythe respective independent claims.

According to a first aspect, an electrical node is provided. Theelectrical node, which may be realized as a component, comprises a firstsubstrate film defining a cavity, and a first material layer arranged toat least partly fill the cavity, and to embed or at least partly coverat least one electrical element arranged into the cavity.

In various embodiments, the cavity may define or exhibit a shape of, forexample having regard to its cross-section, section and/or overallshape, substantially rectangular, dome-shaped, rounded, hemispherical,truncated cone, and/or other preferred shape(s).

A substrate film such as the first substrate film may refer herein to asubstrate in which one (e.g. z, such as “thickness”) of the threedimensions is significantly shorter with respect to the other two (e.g.x and y) dimensions. The film substrate may, at least originally, beessentially planar or planar-like substrate.

In various embodiments, the first material layer may advantageously beof or comprise elastic material, such as elastomer or polyurethane,which materials used may be thermoplastic materials.

In various embodiments, the at least one electrical element may beattached or printed, such as screen printed or inkjet printed, on thefirst substrate film and into the cavity.

In various embodiments, the electrical node may comprise at least onesecond substrate, such as a printed circuit board, ceramic electricalsubstrate, film substrate, printed film substrate or patternedconductive polymer substrate, said at least one second substratepreferably comprising (hosting or defining, for instance) e.g. one ormore electrical elements of the at least one electrical element, whereinthe second substrate may be further arranged so that at least electricaland/or other element hosted by it is positioned into the cavity andembedded in or at least partly covered by the first material layer.

In various embodiments, the electrical node may comprise at least oneelectrical contact element electrically connected to the at least oneelectrical element, wherein the at least one electrical contact elementis configured for providing electrical connection, such as galvanic,capacitive or inductive connection, into the node and e.g. said at leastone electrical element, typically from the environment and/or exteriorof the node (host structure, external system, etc.).

In various embodiments, the electrical node may comprise a secondmaterial layer arranged on the at least one electrical element forreducing e.g. air pockets between the at least one electrical elementand the first material layer.

In various embodiments, the electrical node may comprise at least onesecond electrical element, such as a capacitive sensing element or anantenna or a resonating element, arranged on the first substrate film onthe opposite side of the first substrate film with respect to thecavity.

In various embodiments, the at least one electrical contact element maybe arranged at least at a peripheral portion of the first substrate filmfor providing electrical connection into the node, such as via galvanic,capacitive or inductive coupling element or elements.

In various embodiments, the electrical node may comprise an air pocketwithin the first material layer. The air pocket or generally gas pocketmay contain any one or more gases, such as air or inert gases, forinstance.

In various embodiments, the first substrate film may be a formed, suchas a thermoformed, substrate film, and/or an injection molded substratefilm defining the cavity.

In various embodiments, the node, or an embodiment of a multilayerstructure or assembly comprising at least one node (described in moredetail hereinlater), comprises at least one thermal management element,for cooling or heating, for instance, such as at least one elementselected from the group consisting of: a heat sink, a thermal slug, anda thermal well. The thermal management element may be arrangedcompletely within the cavity, or partly within/outside the cavity, forexample, on the first substrate film or extending outside the cavityfrom an essentially open side of the cavity. In some embodiments, thethermal management element may be arranged through the first substratefilm via a cut or a through-hole, for instance. Furthermore, the thermalmanagement element may be arranged the extend through the secondsubstrate, if any.

In various embodiments, the thermal management element may comprise aheat sink, which may be arranged e.g. completely or at least partlyinside the cavity.

In various embodiments, element(s) such as conductors, contacts orconnectors, as a part of, connected or integral with the thermalmanagement element, may comprise material having high thermalconductivity, such as of thick copper conductors.

In various embodiments, the thermal management element or elements, suchas heat pipes, may be arranged in connection with one or more otherfeatures of the node, such as a connector or contact, to optionallyoperate e.g. as a heat sink or to conduct heat into or out of the node.

In some embodiments of e.g. the assembly or multilayer structure, atleast one thermal management element may be located essentially outsidethe node, optionally integral or connected with an element such aselectronic component, considering e.g. highpower LEDs prone to(over)heating in certain circumstances. A thermal management element maybe a substantially monolithic element, multi-part element (the parts maybe removably or fixedly connected), and/or integral with some otherelement(s), such as a connector or electrical element.

In various embodiments, the thermal management element may be configuredto at least thermally, if not e.g. physically, to connect or contact thenode, a feature such as an electrical element, fill, substrate,conductor, contact and/or connector thereof, other element outside thenode, and/or e.g. (electronic) component of the multilayer structure orassembly including at least one node. The associated thermal connectionmay be convection, conduction and/or radiation based, for instance.

According to a second aspect, a method for manufacturing an electricalnode is provided. The method comprises obtaining a first substrate filmdefining a cavity, and providing a first material layer by filling atleast partly the cavity with a first material, wherein at least oneelectrical element arranged into the cavity is being embedded in or atleast partly covered by the first material layer.

In an embodiment, the method may comprise providing at least oneelectrical contact element to the electrical node, wherein the at leastone electrical contact element is electrically connected to the at leastone electrical element, and wherein the at least one electrical contactelement is configured for providing electrical connection, such asgalvanic, capacitive or inductive connection, into the node.

In an embodiment, the at least one electrical contact element may bearranged at least at a peripheral portion of the first substrate filmfor providing electrical connection into the node.

In an embodiment, the method may comprise, prior to the provision of thefirst material layer, printing, such as screen printing or inkjetprinting, at least portion of the at least one electrical element on thefirst substrate film and arranged into the cavity defined by the film.In addition to or instead of printing, at least partially ready-madeelectrical element may be mounted upon the film.

In an embodiment, the method may comprise obtaining at least one secondsubstrate, such as a printed circuit board or a piece thereof, or a filmtype substrate, comprising the at least one electrical element, andarranging the second substrate so that the at least one electricalelement is positioned into the cavity.

In an embodiment, the obtaining of the first substrate film may compriseprocessing preferably through forming, such as thermoforming, asubstrate film to define the cavity, or obtaining the first substratefilm by molding, such as injection molding, to comprise the cavity. Atleast a portion of an element such as an electrical element of the atleast one electrical element may be provided to the first substrate filmprior to (while the first substrate film may still be substantiallyplanar, for example, or more slightly three-dimensional) or subsequentto forming.

According to a third aspect, an electrical node assembly, such as astrip or sheet, comprising a plurality of electrical nodes is provided.The strip or sheet comprises a first substrate film defining a pluralityof cavities, and at least a corresponding number of first materiallayers with respect to a number of the plurality of cavities, whereineach of said first material layers at least partly fills a respectiveone of the cavities and embeds the at least one electronic componenttherein.

In an embodiment, the electrical node strip or sheet, or other assembly,may comprise at least two of the corresponding number of first materiallayers forming common first material layer.

According to a fourth aspect, a multilayer structure for hosting e.g.electronics is provided. The multilayer structure preferably comprises

-   -   at least one electrical node comprising: a first substrate film        defining a cavity, and a first material layer arranged to at        least partly fill the cavity, and to embed or at least partly        cover at least one electrical element arranged into the cavity;        and/or    -   at least one electrical node assembly such as a strip or sheet        comprising: a first substrate film defining a plurality of        cavities, and at least a corresponding number of first material        layers with respect to a number of the plurality of cavities,        wherein each of said first material layers at least partly fills        a respective one of the cavities and embeds the at least one        electronic component therein.

The multilayer structure further preferably comprises a host substrateconfigured to host e.g. electronics, wherein said at least oneelectrical node or said at least one electrical node strip or sheet maybe arranged on the host substrate, and preferably e.g. a molded or castmaterial layer covering said at least one electrical node or said atleast one electrical node strip or sheet is additionally provided on thehost substrate.

In an embodiment, said at least one electrical node or said at least oneelectrical node strip or sheet may be arranged on the host substratesuch that the at least one electrical element is, or the elements are,between the first substrate film and the host substrate.

In an embodiment, the multilayer structure may comprise at least onesecond electrical element arranged at on one of the first substrate filmon the opposite side of the first substrate film with respect to thecavity.

The present invention provides advantages over known solutions such thatthe electrical node reduces the complexity of integratingfunctionalities, for example, electrical circuits forming switch-modepower supplies and dense-pitch microcontrollers, into multilayerstructures. In many cases the amount of wiring is also reduced. Thenumber of functionalities that can be easily embedded in an electricalnode according to the present invention greatly enhance value gainedfrom implementing the structure and its functionalities with IMSEinstead of using any of the available traditional technologies. Theelectrical node has a structure that can be optimized for efficiency,low electromagnetic interference (EMI) or other parameters, forinstance. For example, a switch-mode circuitry can be tailored to meetemission limits with greatly reduced risk for failing results inelectromagnetic compatibility (EMC) tests. From a software developingperspective, the effort required to implement IMSE structures can alsobe greatly reduced, as pre-selected and pre-manufactured electricalnodes will have known structure and known functionalities. Providingdrivers with the possibility to auto-generate driver code based onpre-configurable functionality models can enable implementing thefunctionalities.

Additionally, the electrical node approach enables using a much greaterproportion of currently available electrical components: most of the newcomponents released to the market are packaged in very dense, tinypackages with potentially very high power density that are verychallenging to directly integrate in IMSE structures due to physicallimitations: print resolution, adhesive spreading and splatter, reliablefilling and exclusion of air. For a designer not intimately familiarwith the challenges in directly embedding complex circuitry and manycomponents in plastic, the electrical node approach is significantlysafer way to integrate the functionalities.

By inclusion of thermal management elements in the nodes, assemblies ormultilayer structures as discussed herein many potential thermalmanagement related issues such as overheating of electronic componentsmay be reduced or avoided.

Various other advantages will become clear to a skilled person based onthe following detailed description.

The expression “a number of” may herein refer to any positive integerstarting from one (1).

The expression “a plurality of” may refer to any positive integerstarting from two (2), respectively.

The terms “first”, “second”, “third” and “fourth” are herein used todistinguish one element from other element(s), and not to speciallyprioritize or order them, if not otherwise explicitly stated.

The exemplary embodiments of the present invention presented herein arenot to be interpreted to pose limitations to the applicability of theappended claims. The verb “to comprise” is used herein as an openlimitation that does not exclude the existence of also un-recitedfeatures. The features recited in various embodiments and e.g. dependentclaims are mutually freely combinable unless otherwise explicitlystated.

The novel features which are considered as characteristic of the presentinvention are set forth in particular in the appended claims. Thepresent invention itself, however, both as to its construction and itsmethod of operation, together with additional objectives and advantagesthereof, will be best understood from the following description ofspecific embodiments when read in connection with the accompanyingdrawings.

BRIEF DESCRIPTION OF FIGURES

Some embodiments of the invention are illustrated by way of example, andnot by way of limitation, in the figures of the accompanying drawings.

FIG. 1 illustrates schematically an electrical node according to anembodiment of the present invention.

FIG. 2 illustrates schematically an electrical node according to anembodiment of the present invention.

FIG. 3 illustrates schematically an electrical node according to anembodiment of the present invention.

FIGS. 4A-4D illustrate schematically an electrical node according to anembodiment of the present invention.

FIGS. 5A and 5B illustrate schematically a subassembly utilizable in anelectrical node according to an embodiment of the present invention.

FIGS. 6A-6C illustrate schematically electrical nodes according to someembodiments of the present invention.

FIG. 7 illustrates schematically an electrical node strip according toan embodiment of the present invention.

FIGS. 8A and 8B illustrate schematically an electrical node sheetaccording to an embodiment of the present invention.

FIG. 9 illustrates schematically an electrical node according to anembodiment of the present invention.

FIG. 10 illustrates schematically a multilayer structure according to anembodiment of the present invention.

FIG. 11 illustrates a flow diagram of a method according to anembodiment of the present invention.

FIGS. 12A and 12B illustrate various stages of manufacturing anelectrical node according to an embodiment of the present invention.

FIG. 13 illustrates schematically a further embodiment of the electricalnode, provided with a number of applicable thermal management features.

FIG. 14 illustrates schematically still a further embodiment of theelectrical node, provided with a number of related thermal managementfeatures.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

Various embodiments of electrical nodes are described below, to beoptionally flexibly and/or selectively combined by a person skilled inthe art upon need.

FIG. 1 illustrates schematically an electrical node 100 according to anembodiment of the present invention. The electrical node 100 in FIG. 1comprises a first substrate film 10, such as of polycarbonate (PC) orcomprising PC, defining a cavity 15 (e.g. a recess or protrusion shapedepending on the inspection angle) and a first material layer 30 orvolume arranged to at least partly fill the cavity 15, and to embed orat least partly cover at least one electrical element 12 arranged intothe cavity 15. In FIG. 1, the at least one electrical element 12, suchas a capacitive sensing element or a conductor or a printed electronicscomponent, such as a light emitting diode, has been printed, such asscreen printed or inkjet printed, and/or otherwise provided on the firstsubstrate film 10 and into the cavity 15. The element 12 may have beenprovided on the bottom of the cavity IS, for instance (e.g.substantially centered or provided closer to a side wall thereof). Theremay be only one element 12 or advantageously a plurality of electricalelements 12 forming e.g. an electrical circuit capable of providing atleast one functionality, such as lighting. Furthermore, there may be atleast one electrical contact or generally connection, or connecting,element 16 arranged to the electrical node 100 and configured forproviding electrical connection, such as galvanic, capacitive orinductive connection, into the node 100, typically particularly fromoutside the node 100, e.g. from element(s) residing on a common hostsurface, structure or generally substrate with the node 100 and/or fromelement(s) external thereto. The electrical contact element 16 may beelectrically connected via an intermediate electrical connection element14, such as an electrical conductor 14, such as printed conductor, withthe at least one electrical element 12 or the electrical circuitthereof, if not being directly connected therewith, for which purposethe element 12 may comprise a number of connecting features such asterminals or contacts.

According to various embodiments, the first material layer 30 may be orcomprise polymer, plastic and/or silicone, for instance. According tovarious advantageous embodiments, the first material layer 30 may beelastic, thus providing e.g. mechanical protection for the electricalelement or elements 12 embedded therein or at least pertly covered bythe first material layer 10.

In some embodiments, the first material layer 30 may be comprised of aplurality of materials or material layers.

FIG. 2 illustrates schematically an electrical node 100 according to anembodiment of the present invention. The electrical node 100 in FIG. 2comprises a first substrate film 10 defining a cavity 15 and a firstmaterial layer 30 arranged to at least partly fill the cavity 15, and toembed or at least partly cover at least one electrical element 12arranged into the cavity 15. In FIG. 2, the electrical node 100 furthercomprises a second substrate 20, such as a printed circuit board or apiece thereof, or a further film, comprising the at least one electricalelement 12. Furthermore, the second substrate 20 is arranged so that theat least one electrical element 12 is positioned into the cavity 15 andembedded in or at least partly covered by the first material layer 30.There may be only one element 12 or advantageously a plurality ofelectrical elements 12 forming an electrical circuit capable ofproviding a functionality, such as lighting, on the second substrate 20.Furthermore, there may be an electrical contact element 16 arranged tothe electrical node 100 and configured for providing electricalconnection, such as galvanic, capacitive or inductive connection, intothe node 100. As contemplated hereinbefore with respect to FIG. 1, theelectrical contact element 16 may be electrically connected, optionallyvia an electrical connection element 14, with the at least oneelectrical element 12 or the electrical circuit thereof. There may be anumber of features 25 such as electrical elements provided to the firstfilm 10 as well, on any side of (depicted in the figure on the sidefacing the cavity 15).

FIG. 3 illustrates schematically an electrical node 100 according to anembodiment of the present invention. The electrical node 100 in FIG. 3comprises a first substrate film 10 defining a cavity 15 and a firstmaterial layer 30 arranged to at least partly fill the cavity 15, and toembed or at least partly cover at least one electrical element 12arranged into the cavity 15. However, in this case, there are at leasttwo electrical elements 12 arranged into the cavity 15, at least onebeing arranged as in FIG. 1 and at least one other as in FIG. 2.

Furthermore, applicable also to FIGS. 1 and 2, there may be at least onesecond electrical element 26 arranged on the first substrate film 10 onthe opposite side of the first substrate film 10 with respect to thecavity 15. In FIG. 3, the second electrical element 26, such as acapacitive sensing element 26, is arranged at a corresponding positionwith respect to the cavity 15, however, the second electrical element 26could alternatively or in addition be arranged in other parts of thefirst substrate film 10 (see e.g. item 25 of FIG. 2). Still as a furtheroption, the second electrical element 26 may be connected through asecond electrical connection element 27 and/or via the feedthrough 28 toa feature such as an electrical contact element 16, being the same or adifferent one with respect to the electrical contact element 16 inconnection with the electrical element 12.

According to various embodiments, such as any of ones shown in FIGS.1-3, the node 100 may comprise a number of thermal management featuresor elements such as a heat sink for cooling the node, particularly theelectrical element 12 or elements 12, thereof. The heat sink and/orother thermal management feature(s) may be embedded e.g. into the firstmaterial layer 30 and/or provided at least partly outside of the node100 (utilizing e.g. a via/hole provided in the exterior part such asfilm 10 optionally prior to or subsequent to e.g. provision of coverplastics thereon using e.g. molding) in order to provide cooling, forinstance. Still further, the heat sink or similar functionality may bearranged in connection with a heat exchanging element of an externaldevice, or, for example, of a circuit board (consider e.g. metal core orthermal PCB). Generally, a thermal management element or feature mayhave a high thermal conductivity and e.g. heat dissipation properties,provided by the included material(s), dimensions, shape and/or (surface)area thereof. The material(s) may include many metals (e.g. copper,silver, aluminium) and their alloys in addition to or instead of e.g.thermally conductive polymers, pastes, molded material(s), for instance.In some embodiments, a thermal management element that is essentially athermal insulator, may be utilized in addition to or instead of thermalconductors.

Thermal management element 35 may advantageously be configured todistribute, convey or spread thermal energy/heat within and/or outsidethe node 100. Thermal energy or heat may be conveyed to a selected orwhole area of the node 100, and then outside the node 100, for example,through a second substrate 20, if any, or a host substrate 60,therefore, yielding e.g, more efficient cooling of the node 100 withrespect to providing cooling at a single point. This may be particularlybeneficial if the node 100 comprises compact high-power components, suchas high-power LEDs or LED drivers, in order to avoid hotspots.

In various embodiments, the thermal conductivity of such thermalmanagement element 35, or at least a part of it, may preferably be atleast 2 W/mK, or preferably at least 10 W/mK, or more preferably atleast 50 W/mK, or most preferably at least 100 W/mK. As beingappreciated by a person skilled in the art, various materials having alower thermal conductivity may be considered as thermal insulatorswhereas materials associated with a higher thermal conductivity may begenerally more effectively utilized as thermal conductors e.g. forcooling/heat transfer purposes. The desired thermal conductivity may beobtained by suitable material selection of the thermal managementelement 35, for instance. In some embodiments, plastic material havingthermal conductivity at least 10 W/mK may be utilized. In variousembodiments, metal material, such as copper, aluminium, zinc, ortin-silver-copper (SnAgCu) composition, such as Sn—Ag3.5-Cu9.0, may beutilized in the thermal management element 35 or at least in partthereof. Thermal conductivities of various such metals are of the orderof at least about 60 W/mK. Thus, quite many metals offer a betterthermal conductivity than typical plastic materials, which may beexploited in various embodiments of the present invention for thermalmanagement.

In various embodiments, the thermal management element 35, such as athermal well, a thermal slug or a thermal pad, may be implemented atleast partly by e.g. a lead frame, such as comprising of copper orcopper alloy, of an electrical or electronics component. Furthermore,e.g. a thermal well may be implemented by a matrix of inlets through asubstrate, such as a PCB. Thermal wells may particularly advantageouslybe utilized in multilayer substrates. Examples of thermal slugs or padsmay comprise thermally conductive material arranged on a thin-shrinksmall-outline package (TSSOP) or on a quad-flat no-lead (QFN) package.

According to an embodiment, the electrical node 100 may indeed comprisea circuit board, such as the second substrate 20, or an electricalelement 12 having a metal core or based on multilayer ceramicstechnology, such as high temperature co-fired ceramics (HTCC) or lowtemperature co-fired ceramics (LTCC), which may further provide coolingand/or heating through thermal conduction.

According to an embodiment, the thermal management element(s) 35 may, inaddition to or instead of comprising dedicated element(s), be integratedwith a number of elements and/or components of the electrical node 100.For example, this may entail utilizing electrical conductors designedwith such properties, such as dimensions, that they function as athermal management element 35 or at least a portion thereof, such as aheat sink or thermally conductive element.

In various embodiments, the electrical node 100 may comprise a thermalmanagement element 35, such as at least one of the following: a heatsink, a thermal slug, a thermal well. The thermal management element 35may be arranged within the cavity 15 or at least partly outside thecavity 15, for example, on the first substrate film 10 or extendingoutside the cavity from an open side of the cavity 15. The thermalmanagement element 35 may, additionally or alternatively, be arrangedthrough the first substrate film 10 via a cut or a through-hole, forinstance. Furthermore, the thermal management element 35 may be arrangedthe extend through the second substrate 20, if any. Additionally oralternatively, the thermal management element 35 may comprise a heatsink arranged completely or at least partly inside the cavity 15. Insome embodiments, the electrical contact element 16, as a part of thethermal management element 35, may comprise or consist of materialhaving high thermal conductivity, such as of thick copper conductors.The thermal management element 35 or elements 35, such as heat pipes,may alternatively or additionally be arranged in connection with theelectrical contact element 16 for operating as a heat sink or to conductheat into or out of the electrical node 100.

In various embodiments, the electrical node 100 may comprise, such asbeing provided into the cavity 15, thermally conductive first materiallayer 30 to operate in addition to e.g. protective layer, for instance,as thermal management element 35. Still further, the first materiallayer 30 may be provided only partly, such as at corresponding positionswith heat generating components, such as processing units or resistors,by utilizing thermally conductive material while the rest of the firstmaterial layer 30 may be of other material.

According to various embodiments in which the electrical node 100 hasbeen arranged on a host substrate 60 or structure, the thermalmanagement element(s) 35 may be in thermal connection with thermalmanagement element(s) 35 of the host substrate 60. For example, theremay be graphite or copper, such as pieces of graphite or copper tape,arranged on the host substrate 60 with corresponding positions with theelectrical node 100. Still further, these thermally conductive elementsmay extend along the host substrate 60 to conduct heat away, forexample, from the node 100.

In various embodiments comprising the electrical node 100 arranged on ahost substrate 60 or structure, and comprising a molded or cast materiallayer 90 on the node 100, at least part of the molded or cast materiallayer 90 may be of thermally conductive material, if not completely,such as the part at least partly covering or embedding the firstsubstrate film 10.

FIGS. 4A-4D illustrate schematically an electrical node 100 according toan embodiment of the present invention. FIGS. 4A-4D illustrate theelectrical node 100 as a cross-sectional side view, from above, frombelow, and from a perspective view, respectively. The electrical element12, such as a printed or mounted component, is arranged preferablytherewithin, e.g. on the bottom of the cavity 15, and, optionally,conductors 14 connecting the electrical element 12 to the electricalcontact element 16 are arranged at the peripheral part of the firstsubstrate film 10.

FIGS. 4B-4D further illustrate a functional and/or decorative element 41being arranged on the first substrate film 10. The functional element 41in FIGS. 4B-4D is or comprises, for example, a window of transparentmaterial passing through light emitted by a light source arranged in thecavity 15, such as by a light-emitting diode (LED) type element 12. Itmay be utilized as a visual or optical indicator, and/or for lightingpurposes, for example.

Figures SA and SB illustrate, at 500 and 502, schematically asubassembly utilizable in an electrical node 100 according to anembodiment of the present invention. The subassembly may comprise aplurality of electrical elements 12, preferably interconnected elements12, forming an electrical circuit of the subassembly. The electricalcircuit of this example case comprises elements of a two-channel LEDdriver can be as one subassembly on a substrate 20, such as a PCB. Thesubassembly may comprise, for example at the peripheral part thereof,inputs and/or outputs, in form of electrical contact elements 16, suchas for electrical power, ground, two PWM (pulse-width modulation)inputs, two LED string anodes and two LED string cathodes on large, easyto mount contact pads instead of the complex jumble of circuitry betweensupply capacitors, inductors, timing resistors, sense resistors andtiny, power-dense driver IC. The subassembly may then be arranged intothe cavity 15 and at least partly embedded or at least partly covered bythe first material layer 30 according to an embodiment of the presentinvention. However, it could also be produced directly on the firstsubstrate film 10 and into the cavity 15 or a region later establishingthe cavity 15, and then arranged at least partly embedded or at leastpartly covered by the first material layer 30. It should further benoted, however, that various different kinds of subassemblies orelectrical circuits having and/or configured to perform one or severalfunctionalities may be arranged into an electrical node 100 according toan embodiment of the present invention, and not limited to theelectrical circuit described hereinabove.

FIGS. 6A-6C illustrate schematically electrical nodes 100 according tosome embodiments of the present invention. The electrical node 100 inFIG. 6A comprises a first substrate film 10 defining a cavity 15 and afirst material layer 30 arranged to at least partly fill the cavity 15,and to embed or at least partly cover at least one electrical element 12arranged into the cavity 15. In FIG. 2, the electrical node 100comprises a second substrate 20, such as a printed circuit board or apiece thereof, comprising the at least one electrical element 12.Furthermore, the second substrate 20 is arranged so that the at leastone electrical element 12 is positioned into the cavity 15 and embeddedin or at least partly covered by the first material layer 30. There maybe only one element 12 or advantageously a plurality of electricalelements 12 forming an electrical circuit capable of providing afunctionality, such as lighting, on the second substrate 20.Furthermore, there may be an electrical contact element 16 arranged onthe opposite side of the second substrate 20 with respect to the atleast one electrical element 12 for providing electrical connection intothe node 100.

FIG. 6A further illustrates a host substrate 60, such as a PCB or a filmtype substrate of e.g. plastic and/or organic material, onto which theelectrical node 100 has been arranged on. The host substrate 60preferably comprises electrical contact areas 61 to which the electricalnode 100 may be, for example, attached by using conductive adhesive. Theelectrical node 100 is thus a component-like entity configured toperform one or several functionalities. The electrical connectionbetween the node 100 and the host substrate 60, although shown asgalvanic connection, may as well be arranged as capacitive or inductiveconnection. Furthermore, the first substrate film 10 of the electricalnode 100 advantageously protects the components of in the cavity 15 whenbeing overmolded by plastic and/or generally covered by furthermaterial, for instance.

The electrical node 100 in FIG. 6B is similar to one shown in FIG. 6Aexcept that a second material layer 65 has been provided therewithine.g. on the at least one electrical element 12 for reducing air pocketsforming between the at least one electrical element 12 and the firstmaterial layer 30. The material(s) of the second layer 65 may differfrom the one(s) of the primary fill (first layer) 30. The secondmaterial layer 65 may be covering the at least one electrical element12, or at least some of them, if many, and, optionally, also at leastpart of the second substrate 20. The second material layer 65 maycomprise or be, for example, of very easy-flowing and thoroughly wettingmaterial, such as of liquid resin. The second material layer 65 mayadvantageously be used as a pre-filling material which flows into smallgaps between electrical elements 12, such as electronic components,and/or parts of the structure and, thus, simplifies the geometry and/or“smooths” the surface(s) for facilitating the application of the firstmaterial layer 30.

The second material layer 65 may be of or comprise material, or asimilar material, that is typically used in capillary underfill of ICcomponents. The material layer 65 may, thus, be of a mixture of liquidorganic resin binder and inorganic fillers. The organic binder maycomprise, for example, epoxy resin mix or cyanate ester. Inorganicfiller may include, for example, silica.

Alternatively or in addition, the second material layer 65 may beutilized in embodiments in which at least one electrical element 12 isarranged on the first substrate film 10 and into the cavity 15 forreducing air pockets.

The electrical node 100 in FIG. 6C is similar to one shown in FIG. 6Aexcept that a layer such as a protective layer 67 has been arranged onthe first substrate film 10. The protective layer 67 may also compriseon one or either one of its surfaces functional elements such ascapacitive sensing elements or lighting devices or optical elements. Theprotective layer 67 may comprise e.g. a protective film, coating, shellstructure and/or molded (plastic) layer as described in more detail withreference to FIG. 10, for instance. The protective layer 67 may coverone or a plurality of entities such as nodes 100 and/or other featuressuch as electronic components provided on the host substrate 60.

FIG. 7 illustrates schematically an electrical node strip typeembodiment of an assembly 200 according to the present invention. Thestrip assembly 200 comprises e.g. elongated first substrate film 10defining a plurality of cavities 15, in this case two, and at least acorresponding number of first material layers 30 with respect to anumber of the plurality of cavities 15. Each of said first materiallayers 30 at least partly fills a respective one of the cavities 15 andembeds the at least one electronic component 12 therein. There may beelectrical contact elements 16 arranged on the first substrate film 10which may further be connected to the electrical elements 12 in one orboth of the cavities 15.

Furthermore, at least two of the corresponding number of first materiallayers 30 may form common first material layer 30. This may entail thatthe first material layer 30 essentially extends between two cavities 15thus forming continuous material layer.

FIGS. 8A and 8B in turn illustrate schematically an electrical nodesheet type assembly 200 according to an embodiment of the presentinvention. In FIG. 8A, the sheet assembly 200, hereinafter sheet, isshown as a perspective view from above the sheet 200. In FIG. 8B, thesheet 200 is shown as a perspective view from below the sheet 200. Thesheet 200 comprises a first substrate film 10 defining a plurality ofcavities 15, in this case four, and at least a corresponding number offirst material layers 30 with respect to a number of the plurality ofcavities 15. Each of said first material layers 30 at least partly fillsa respective one of the cavities 15 and embeds the at least oneelectronic component 12 therein. There may be electrical contactelements 16 arranged on the first substrate film 10 which may further beconnected to the electrical elements 12 in one, some or each of thecavities 15. Furthermore, at least two of the corresponding number offirst material layers 30 may form common first material layer 30. Thismay entail that the first material layer 30 essentially extends betweentwo cavities 15 thus forming continuous material layer.

FIGS. 7, 8A and 8B further illustrate a functional element 41 beingarranged on the first substrate film 10. The functional element 41 maycomprise, as discussed hereinearlier, for example, a window oftransparent material passing through light emitted by a light sourcearranged in the cavity 15, such as by a LED.

In FIG. 8B, it is further illustrated that there may be more than oneelectrical element 12 arranged into one cavity 15. In this case, thelower left cavity 15, depicting “ON” and “OFF”, may comprise e.g. twoLEDs which are configured to illuminate one functional element 41,respectively, that is “ON” and “OFF”. There may further be structuresblocking the light of one LED from penetrating into the section of theother LED.

FIG. 9 illustrates schematically an electrical node 100 according to anembodiment of the present invention. The electrical node 100 in FIG. 9comprises a pocket such as air pocket 85 within the first material layer30. The pocket 85 may contain any selected gas, such as air and/or oneor several inert gases, or basically any type of gas or a combinationthereof.

According to an embodiment, the pocket 85 may be utilized to enable theoperation of e.g. a microelectromechanical system (MEMS) component 80,such as a switch, which requires that there is some free space or volumefor a part of the component 80 to sufficiently move, for instance, tooperate duly. The component 80 is a herein one type of an electricalelement 12.

FIG. 10 illustrates schematically a multilayer structure 300 accordingto an embodiment of the present invention. The multilayer structure 300may comprise at least one electrical node 100 comprising: a firstsubstrate film 10 defining a cavity 15, and a first material layer 30arranged to at least partly fill the cavity 15, and to embed or at leastpartly cover at least one electrical element 12 arranged into the cavity15; or at least one electrical node strip 200 or sheet 200 comprising: afirst substrate film 10 defining a plurality of cavities 15, and atleast a corresponding number of first material layers 30 with respect toa number of the plurality of cavities 15, wherein each of said firstmaterial layers 30 at least partly fills a respective one of thecavities 15 and embeds the at least one electronic component 12 therein.The multilayer structure 300 may further comprise a host substrate 60,wherein said at least one electrical node 100 or said at least oneelectrical node strip 200 or sheet 200 is arranged on the host substrate60. Furthermore, the structure 300 may comprise a molded or castmaterial layer 90 covering said at least one electrical node 100 or e.g.said at least one electrical node strip 200 or sheet 20 on the hostsubstrate 60. In some embodiments, there may be at least one furtherelement such as a second substrate film 95 arranged on the opposite sideof the molded or cast material layer 90. The molded or cast materiallayer 90 may be at least partly transparent and thus light can traveltrough the layer 90. Furthermore, the second substrate film 95, if any,may also include a number of decorative and/or functional elements 41,such as windows for passing through light emitted by a LED in the cavity15, for instance. Yet, the structure 300 may host a number of elementssuch as electric or specifically electronic components 55 provided(mounted, printed, etc.) on the host substrate 60 and/or at leastpartially embedded in the layer 90, for instance. At least some of suchelements 55 may be functionally such as electrically coupled to the node100, and e.g. element 12 therein, via applicable connecting elementssuch as contacts and/or conductor traces, optionally defining at least aportion of a greater circuit design upon the host substrate 60, forexample.

According to an embodiment, the at least one electrical node 100 or theat least one electrical node strip 200 or sheet type assembly 200 may bearranged on the host substrate 60 such that the at least one electricalelement 12 is or elements 12 are between the first substrate film 10 andthe host substrate 60.

According to an embodiment, the multilayer structure 300 may comprise atleast one second electrical element arranged at on the first substratefilm 10 on the opposite side of the first substrate film 10 with respectto the cavity 15.

FIG. 11 illustrates a flow diagram of a method according to anembodiment of the present invention. At the beginning of the method formanufacturing an electrical node 100, a start-up phase 900 may beexecuted. During start-up, the necessary tasks such as material, forexample substrates, component and tools selection, acquisition,calibration and other configuration tasks may take place. Specific caremust be taken that the individual elements and material selections worktogether and survive the selected manufacturing and installationprocess, which is naturally preferably checked up-front on the basis ofthe manufacturing process specifications and component data sheets, orby investigating and testing the produced prototypes, for example. Theused equipment such as molding/IMD (in-mold decoration), lamination,bonding, (thermo)forming, electronics assembly, cut-ting, drillingand/or printing equipment, among others, may be thus ramped up tooperational status at this stage.

At 910, a first substrate film 10 defining a cavity 15 may be obtained.According to an embodiment, the first substrate film 10 may be obtainedby forming, such as thermoforming, cold-forming or utilizing vacuum orhigh pressure, an initial substrate film to define the cavity 15.According to another alternative or additional embodiment, the firstsubstrate film 10 may be obtained by molding, such as injection molding,optionally directly in its target three-dimensional shape containing thecavity 15.

At 920, at least a first material layer may be provided by filling (e.g.by pouring, dispensing and/or (low-pressure) molding) at least partlythe cavity with a first material. At least one electrical element 12arranged into the cavity may at this step be embedded in or at leastpartly covered by the first material layer. At least one element of theelectrical element 12 may be arranged to a target surface or material,e.g. on film 10, by mounting and/or printing, for example, optionallyprior to or after said forming.

In some embodiments, the method may comprise providing at least oneelectrical contact or connection element 16 to the electrical node 100.The at least one electrical contact element 16 may be electricallyconnected to the at least one electrical element 12. The at least oneelectrical contact element 16 may be configured for providing electricalconnection, such as galvanic, capacitive or inductive connection, intothe node 100, especially from outside the node 100. This may entail, forexample, having electrical contact pads 16 which may be optionallyattached, such as soldered or by using conductive adhesive, toelectrical contact elements of a host substrate 60, such as a PCB, forinstance. According to various embodiments, the at least one electricalcontact element 16, one or several, may be arranged at a peripheralportion of the first substrate film 10 for providing electricalconnection into the node 100.

In some embodiments, as alluded to above, the method may compriseprinting, such as screen printing or inkjet printing, or other forms ofprinted electronics technology, the at least one electrical element 12on the first substrate film 10 and into the cavity 15, that is, on aportion of the first substrate film 10 forming the inner surface of thecavity 15. Alternatively or additionally, a number of further featuressuch as contact elements 16 may be obtained by printed electronicstechnology.

In some embodiments, the method may comprise obtaining a secondsubstrate 20, such as a printed circuit board, comprising the at leastone electrical element 12, and arranging the second substrate 20 so thatthe at least one electrical element 12 is positioned into the cavity 15so that the at least one electrical element 12 is embedded or at leastpartly covered by the first material layer 30.

In various embodiments, a number of conductive areas defining e.g.conductor lines (traces) and/or contact pads and/or electrodes toconstruct a circuit design are provided on the film(s), either or bothsides thereof, preferably by one or more additive techniques of printedelectronics technology. For example, screen, inkjet, flexographic,gravure or offset lithographic printing may be utilized. Also furtheractions cultivating the film(s) involving e.g. printing or generallyprovision of graphics, visual indicators, optical elements, etc. thereonmay take place here. Accordingly, also a number of electricallynon-conductive or insulating features may be provided preferably byprinted electronics technology in the concerned structure.

In various embodiments, a number of thermal management elements may beprovided (mounted, printed, preferably utilizing printed electronicstechnology, etc.), e.g. in connection with other elements such aselement 12 (optionally integral therewith) as discussed hereinelsewhere.In some embodiments, one or more thermal management elements, or partsthereof, may provided e.g. on a host substrate 60 of a multilayerstructure, outside an electrical node. A feature such as a connector orconductor may in some embodiments, besides its other or potential“primary” function, have also a thermal management function, which maybe taken into account in the design of the feature having regard to e.g.material selection (e.g. both electrically and thermally conductivematerial such as a suitable metal may be used) and shape/dimensions.

In various embodiments, one or more nodes may be then provided in orutilized to establish a system or specifically, integral multilayerstructure as described hereinelsewhere, for instance, the system orparticularly, multilayer structure comprising a number of furtherfeatures, optionally external device(s), in addition to the nodes.

At 999, method execution is ended.

FIGS. 12A and 12B illustrate various potential stages of manufacturingan electrical node according to an embodiment of the present invention.Generally, various aspects described e.g. having regard to FIG. 11 arealso applicable here.

In FIG. 12A, at 121, a first substrate film 10 defining a cavity 15 maybe obtained. According to an embodiment, the first substrate film 10 maybe obtained by forming, such as thermoforming, cold-forming or utilizingvacuum or high pressure, a substrate film (optionally initially planar)to define the cavity 15. According to another alternative or additionalembodiment, the first substrate film 10 may be obtained by molding, suchas injection molding. At 122, at least one electrical element 12 may beprovided on the first substrate film 12 and into the cavity 15.Optionally, an electrical connection element 14 and electrical contactelement 16 may also be provided on the first substrate film 10. At 123,a first material layer 30 may be provided to at least partly fill thecavity 15, and to embed or at least partly cover the at least oneelectrical element 12. In various embodiments, the first 30 andpotential further material layers may optionally at least partiallysolidify, or be solidified, and/or otherwise change in terms ofproperties such as softness or elasticity, using a selected treatment,which may incorporate subjecting to heat, cold, temperature, and/orpressure, for example, and/or responsive to passage of time e.g. insuitable environment as to the above and/or other parameters.

In FIG. 12B, at 221, a first substrate film 10 defining a cavity 15 maybe obtained. According to an embodiment, the first substrate film 10 maybe obtained by forming, such as thermoforming, cold-forming or utilizingvacuum or high pressure, a substrate film to define the cavity 15.According to another alternative or additional embodiment, the firstsubstrate film 10 may be obtained by molding, such as injection molding.At 122, a first material layer 30 may be provided to at least partlyfill the cavity 15. At 123, at least one electrical element 12 may beprovided, preferably on a second substrate 20, into the cavity 15 forembedding or at least partly covering the at least one electricalelement 12. Optionally, an electrical connection element 14 andelectrical contact element 16 may also be provided on the secondsubstrate 20, or on the first substrate film 10, or e.g. aftersolidification of the first material layer 30, on the first materiallayer 30, or on two or more of said elements. According to anotherembodiment, the second substrate 20 comprising the electrical element 12may first be arranged so that the electrical element 12 is in thecavity, or preferably at least part of the substrate 20 also, and onlyafter that the first material layer 30 is being provided into the cavity15 to embed or at least partly cover the electrical element 12.

A system comprising at least one electrical node as described herein(the included nodes may be mutually similar or different in terms ofconstruction, materials, included elements and/or relatedfunctionalities) may be provided. In the system, the at least one nodemay be, optionally removably, attached to an external device, materialand/or structure, e.g. to a selected target or host surface, orsubstrate, thereof, which may be provided with connecting feature(s)such as mechanical and/or electrical connecting elements for the node.

For the external device or structure, the at least one node may providea desired functionality such as a sensing function, processing function,power transfer function, data storage function, indication,communication and/or user interface (UI) function. The at least one nodeand e.g. at least one electrical element such as electronic componenttherein may be functionally such as electrically, electromagnetically,thermally or optically connected to an element such as electroniccomponent of the external device or structure e.g. via one or moreconnecting elements including e.g. a number of conductive traces, pins,connectors, wiring and/or cabling. Additional or alternative wireless(e.g. radio frequency) coupling is possible as well through implementinga selected wireless transfer technology and related elements(transmitter, receiver, transceiver). The at least one node and theelement of the external device or structure may be configured tofunction cooperatively and thus establish a desired joint entity.

In some embodiments the system may be realized as a preferably integralmultilayer structure, few feasible embodiments of which beingdeliberated also hereinbefore. The structure may contain one or moreelectrical nodes, optionally being functionally such as electricallyconnected together. Yet the structure may comprise a host substrate,optionally comprising formable such as thermoformable material that maybe utilized or have been utilized to establish a desiredthree-dimensional shape through forming. The host substrate may beconfigured to accommodate the electrical nodes. Forming of the hostsubstrate into a desired 3D-shape may take place prior to and/orsubsequent to provision of features such as electrical nodes and/orother features thereon.

In various embodiments of the system or a multilayer structure as itsone realization, e.g. molded or cast material layer comprising e.g.thermoplastic material may be provided on the host substrate, thusembedding at least portion of at least one of said one or moreelectrical nodes and/or other features such as further electricalelements (e.g. electronics including electronic component(s), forinstance) provided thereon. The multilayer structure may indeed comprisea number of additional features such as electrical elements and/orthermal management elements provided to the host substrate and/or otherlayer of the structure and further optionally functionally, such aselectrically and/or thermally, connected with at least one of said oneor more electrical nodes to establish a desired connection for e.g.control, power, heat or data transfer purposes therebetween.

According to an embodiment, the electrical element 12 may comprise aprocessing unit, such as a microcontroller, signal processor or aprocessor. By arranging the processing unit into the node 100, access tothe processing unit at least directly via its pins can be prevented.There can be arranged further components into the node 100 through whichthe access is possible and which may include proprietary software andselected protocols for controlled access.

In various embodiments of the node 100, various signals emitted,received and/or processed by it (e.g. by the electrical element 12) maycomprise at least one element selected from the group consisting ofelectrical signal, electromagnetic signal, optical signal, current,voltage, power signal, digital signal, analogue signal, analogueelectrical signal, digital electrical signal, control signal and (other)data signal.

According to one embodiment, the electrical node 100 or relatedsystem/multilayer structure may be used in a security tag for clothing.Yet it may easily find use e.g. in connection with vehicles (e.g.in-vehicle electronics), lighting devices, wearable electronics,computing or communication devices, consumer electronics, measurementdevices, and various other products.

In various embodiments, one or more, typically ready-made, components orelements including electronic components such as various SMDs may beattached or provided on the film(s) or (other) substrate(s) e.g. bysolder and/or adhesives. Alternatively or additionally, printedelectronics technology may be applied to actually manufacture at leastpart of the components, such as OLEDs, directly onto the film(s) orsubstrate(s).

As also discussed hereinelsewhere, the electrical element 12 may beprovided on the film 10 utilizing any feasible positioning orinstallation technique such as standard pick and place method/equipment(when applicable). Applicable bonding (using e.g. adhesive or otherbonding substance), gluing, and/or further securing techniques may beadditionally utilized. Furthermore, the electrical element 12 may beprinted, injection molded or dip molded.

In various embodiments, the electrical element 12 and/or other featuresof the node 100, multilayer structure 300 or aforementioned system maycomprise at least one element selected from the group consisting of:electronic component, electromechanical component, electro-opticalcomponent, radiation-emitting component, light-emitting component, LED(light-emitting diode), OLED (organic LED), side-shooting LED or otherlight source, top-shooting LED or other light source, bottom-shootingLED or other light source, radiation detecting component,light-detecting or light-sensitive component, photodiode,phototransistor, photovoltaic device, sensor, micromechanical component,switch, touch switch, touch panel, proximity switch, touch sensor,atmospheric sensor, temperature sensor, pressure sensor, moisturesensor, gas sensor, proximity sensor, capacitive switch, capacitivesensor, projected capacitive sensor or switch, single-electrodecapacitive switch or sensor, capacitive button, multi-electrodecapacitive switch or sensor, self-capacitance sensor, mutual capacitivesensor, inductive sensor, sensor electrode, micromechanical (MEMS)component, UI element, user input element, vibration element, soundproducing element, communication element, transmitter, receiver,transceiver, antenna, resonator, infrared (IR) receiver or transmitter,wireless communication element, wireless tag, radio tag, tag reader,data processing element, data storage or memory element, electronicsub-assembly, light directing element, lightguide, lens and reflector.In case a sensor requiring functional connection with the environment isarranged e.g. within the node 100, the connection may be furtherprovided thereto (e.g. fluidic, optical and/or electrical connection asalso contemplated hereinbefore).

The node 100, or the multilayer structure 300, may thus incorporateelectronics such as IC(s) and/or various components. At least part ofthe electronics of the multilayer structure 300 may be provided via anelectrical node 100. Optionally, the node and/or one or more otherelements such as electronic components or thermal management elements ofthe multilayer structure may be at least partially overmolded by aprotective plastic layer as discussed hereinbefore. For example,adhesive, pressure, mechanical fixing features, and/or heat may be usedfor mechanical bonding of the node 100 with the film 10 or substrate 20,for instance. Solder, wiring and conductive ink are examples ofapplicable options for providing electrical connections between theelements of the node 100 and/or the structure 300, and with theremaining electrical elements, such as electronic components, in thestructure 300.

Regarding the resulting overall thickness of the obtained electricalnode 100, assembly such as the strip or sheet 200, and/or the multilayerstructure 300, it depends e.g. on the used materials and related minimummaterial thicknesses providing the necessary strength in view of themanufacturing and subsequent use. These aspects have to be considered oncase-by-case basis. For example, the overall thickness of the structurecould be about 1 mm or a few millimeters, but considerably thicker orthinner embodiments are also feasible.

Further layers may be added, especially, to the structure 300 bylamination or suitable coating (e.g. deposition) procedure. The layersmay be of protective, indicative and/or aesthetic value (graphics,colors, figures, text, numeric data, etc.) and contain e.g. textile,leather or rubber materials instead of or in addition to furtherplastics. Additional elements such as electronics may be installed atthe outer surface(s) of the structure 300, such as the exterior surfaceof the substrate. A connector element for implementing e.g. electricalconnection may be provided to the node 10 or structure 300 and connectedto a desired external connecting element such as external connectorand/or connector cable of an external device, system or structure. Forexample, these two connectors may together form a plug-and-socket typeconnection.

In various additional or supplementary embodiments, e.g. the film 10 maycomprise or consist of material(s) such as plastics, e.g. thermoplasticpolymer, and/or organic or biomaterials with reference to e.g. wood,leather or fabric, or a combination of any of these materials with eachother or with plastics or polymers or metals. The film 10 may compriseor consist of thermoplastic material. The film 10 may be essentiallyflexible or bendable. In some embodiments, the film 10 may alternativelybe substantially rigid. The thickness of the film may vary depending onthe embodiment; it may only be of few tens or hundreds of a millimeter,or considerably thicker, in the magnitude of one or few millimeter(s),for example.

The film 10 may, for example, comprise at least one material selectedfrom the group consisting of: polymer, thermoplastic material,electrically insulating material, PMMA (Polymethyl methacrylate), PolyCarbonate (PC), copolyester, copolyester resin, polyimide, a copolymerof Methyl Methacrylate and Styrene (MS resin), glass, PolyethyleneTerephthalate (PET), carbon fiber, organic material, biomaterial,leather, wood, textile, fabric, metal, organic natural material, solidwood, veneer, plywood, bark, tree bark, birch bark, cork, naturalleather, natural textile or fabric material, naturally grown material,cotton, wool, linen, silk, and any combination of the above.

As alluded to hereinbefore, in various embodiments material(s) of thefilm 10 and/or of further layer(s) such as the second material layer 65may at least partially be optically substantially opaque or at leasttranslucent having regard to predefined wavelengths e.g. in visiblespectrum. This is also applicable to the molded or cast material layer90 as well as to the second substrate film 95, if any. The film 10 mayhave been provided with visually distinguishable, decorative/aestheticand/or informative, features such as graphical pattern and/or colorthereon or therein. The features may have been provided on the same sideof the film with the electrical element 12 so that they have been alsoat least partially sealed, or on the opposite side and thus may or maynot be sealed by the plastic material(s) through the associatedovermolding procedure of the electrical node 100, for instance.Accordingly, IML (in-mold labeling)/IMD (in-mold decoration) techniqueis applicable. The used materials may be at least partially, i.e. atleast in places, optically substantially transparent to radiation suchas visible light emitted by the electronics thereon. The transmittancemay be about 80%, 85%, 90%, 95% or higher, for example.

The molded material(s) may comprise thermoplastic and/or thermosettingmaterial(s). Thickness of the molded or otherwise produced layer(s) mayvary depending on the embodiment. It may be, for example, in the orderof magnitude of less than one, one, few or tens of millimeters. E.g. themolded material may be e.g. electrically insulating.

In more detail, an included layer such as the second material layer 65and/or e.g. layer 90 may comprise at least one material selected fromthe group consisting of elastomeric resin, thermoset material,thermoplastic material, PC, PMMA, ABS, PET, copolyester, copolyesterresin, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplasticpolyurethane), polystyrene (GPPS), TPSiV (thermoplastic siliconevulcanizate), and MS resin.

In various additional or supplementary embodiments, a number ofelectrical elements 12, electrical connection elements 14 and/orelectrical contact elements 16, such as pads, comprise at least onematerial selected from the group consisting of conductive ink,conductive nanoparticle ink, copper, steel, iron, tin, aluminium,silver, gold, platinum, conductive adhesive, carbon fibre, alloy, silveralloy, zinc, brass, titanium, solder, and any component thereof. Theused conductive materials may be optically opaque, translucent and/ortransparent at desired wavelengths, such as visible light, so as to maskor let the radiation such as visible light to be reflected therefrom,absorbed therein or let through, for instance.

In various embodiments, selected features including also e.g. graphics,coloring or other visual features may be provided on internal surfacesor layers, e.g. on the side of a (substrate) film 10 that is facing thecavity 15 so that the features remain isolated and thus protected frompotentially detrimental environmental effects at least by the thicknessof the film 10 and potentially of surrounding protective layer 67, 90 ofe.g. molded plastics 10. Accordingly, different impacts, rubbing,chemicals, etc. that could easily damage e.g. painted, printed ormounted surface features do not affect or reach the features. Thefilm(s) may be easily manufactured or processed, optionally cut, into adesired shape with necessary characteristics such as holes or notchesfor exposing the underlying features such as material layers or e.g.electrical elements.

FIG. 13 illustrates schematically a further embodiment of the electricalnode 100, provided with a number of applicable thermal managementfeatures, or elements 35. In the embodiment of FIG. 13, as with variousother embodiments incorporating thermal management elements, a thermalmanagement element 35 may comprise a heat sink which may be optionallyarranged at least partly, such as having a minor portion thereof, orabout or over fifty, sixty, seventy, eighty, or ninety percent of theelement (e.g. volume, area, and/or weight), outside the cavity 15 and/orthe electrical node 100. However, in various embodiments in accordancewith the one schematically shown in FIG. 13, the heat sink may belocated at least partly inside the node 100 and/or specifically thecavity 15. There may, preferably, be a thermal conduction path, such asthrough an opening in the host substrate 60 and/or the second substrate20, if any, between the thermal management element 35 and electricalelements, such as the at least one electrical element 12 or theconverter element, which are arranged into the cavity 15 and generateheat. The thermal conduction path may additionally or alternativelycomprise thermal conductive paste and/or thermally conductive parts orlayers essentially arranged in contact with each other to form the path.In various embodiments, thermal and electrical conduction paths may beat least partially arranged by at least one common element in additionto or instead of dedicated elements, such as a connector or conductorcomprising e.g. selected metal and/or other material, conducting bothheat and electricity.

In various embodiments, the thermal management element 35 may bearranged on the opposite side of the cavity 15 with respect to theclosed side or the top side of the cavity 15 when looking at FIG. 13. Inother words, the thermal management element 15 may preferably bearranged on the open side of the cavity 15 such as in FIG. 13. Parts ofthe thermal conduction path may reside in the node 100 or the cavity 15,such as for conductive heat along the second substrate 20, if any.Furthermore, there may be thermally conductive material, e.g. graphiteor copper, such as pieces of graphite or copper tape, arranged on thehost substrate 60 and/or on an outer surface of the node 100. The tapemay be arranged, for example, on the same side of the node 100 as theopen side of the cavity 15 of the first substrate film 10. Optionally, aconnecting element such as a connector of the node 100 connecting to anexternal device or system may host, be attached to, or define at leastportion of a thermal management element 35.

FIG. 14 illustrates schematically still a further embodiment of theelectrical node 100, provided with a number of related thermalmanagement features, such as elements 35.

In FIG. 14, the thermal management element 35 may be arranged byinjection molding with thermally conductive material. Such a thermalmanagement element 35 may be provide by a two-shot molding technique.There may, preferably, be an opening, such as a cut or the hole orthrough-hole in the host substrate and/or the second substrate 20, ifany, so that the material of the thermal management element 35, such asof a heat sink or a heat pipe, becomes molded close to the heatgenerating element of the node 100.

The scope of the present invention is determined by the attached claimstogether with the equivalents thereof. A person skilled in the art willappreciate the fact that the disclosed embodiments were constructed forillustrative purposes only, and other arrangements applying many of theabove principles could be readily prepared to best suit each potentialuse scenario. For instance, instead of or in addition to molding theplastics directly onto a substrate (e.g. on item 60), a plastic layercould be prepared upfront and then attached to the substrate by suitablelamination technique applying e.g. adhesive, mechanical attachment means(screws, bolts, nails, etc.), pressure and/or heat. Finally, in somescenarios, instead of molding or casting, the plastic or other layercould be produced on the target substrate(s) using a suitable depositionor further alternative method. Yet, instead of printed, (electrically)conductive traces, the traces could be produced/provided otherwise. E.g.a conductor film manufactured utilizing etching or transfer lamination,among other options, could be applied.

The invention claimed is:
 1. An electrical node comprising a firstsubstrate film defining a cavity, a first material layer arranged to atleast partly fill the cavity, and to embed or at least partly cover atleast one electrical element arranged into the cavity; and a thermalmanagement element selected from the group consisting of: a heat sink, athermal slug, and a thermal well, wherein the thermal management elementis arranged completely inside the cavity and embedded into the firstmaterial layer.
 2. The electrical node according to claim 1, comprisingthe at least one electrical element being printed on the first substratefilm and into the cavity.
 3. The electrical node according to claim 1,comprising a second substrate including the at least one electricalelement, wherein the second substrate is arranged so that the at leastone electrical element is positioned into the cavity and embedded in orat least partly covered by the first material layer.
 4. The electricalnode according to claim 1 further comprising at least one electricalcontact element electrically connected to the at least one electricalelement, wherein the at least one electrical contact element isconfigured for providing electrical connection into the node.
 5. Theelectrical node according to claim 1, further comprising a secondmaterial layer arranged on the at least one electrical element forreducing air pockets between the at least one electrical element and thefirst material layer.
 6. The electrical node according to claim 1,further comprising at least one second electrical element arranged onthe first substrate film on the opposite side of the first substratefilm with respect to the cavity.
 7. The electrical node according toclaim 1, wherein the at least one electrical contact element is arrangedat least at a peripheral portion of the first substrate film forproviding electrical connection into the node.
 8. The electrical nodeaccording to claim 1, further comprising an air pocket within the firstmaterial layer.
 9. The electrical node according to claim 1, wherein thefirst substrate film is a formed substrate film or an injection moldedsubstrate film defining the cavity.
 10. A method for manufacturing anelectrical node, the method comprising: obtaining a first substrate filmdefining a cavity, providing a first material layer by filling at leastpartly the cavity with a first material; and providing a thermalmanagement element selected from the group consisting of: a heat sink, athermal slug, and a thermal well, wherein the thermal management elementis arranged completely inside the cavity and embedded into the firstmaterial layer.
 11. The method according to claim 10, furthercomprising: providing at least one electrical contact element to theelectrical node, wherein the at least one electrical contact element iselectrically connected to the at least one electrical element, andwherein the at least one electrical contact element is configured forproviding electrical connection into the node.
 12. The method accordingto claim 10, wherein the at least one electrical contact element isarranged at a peripheral portion of the first substrate film forproviding electrical connection into the node.
 13. The method accordingto claim 10, further comprising, prior to the provision of the firstmaterial layer, printing the at least one electrical element on thefirst substrate film and into the cavity.
 14. The method according toclaim 10, further comprising: obtaining a second substrate comprisingthe at least one electrical element, and arranging the second substrateso that the at least one electrical element is positioned into thecavity.
 15. The method according to claim 14, wherein the obtaining ofthe first substrate film comprises forming, a substrate film to definethe cavity, or obtaining the first substrate film by molding, tocomprise the cavity.
 16. An electrical node assembly comprising aplurality of electrical nodes, the electrical node assembly comprising:first substrate film defining a plurality of cavities; at least acorresponding number of first material layers with respect to a numberof the plurality of cavities, wherein each of the first material layersat least partly fills a respective one of the cavities and embeds atleast one electronic component therein; and at least one thermalmanagement element selected from the group consisting of: a heat sink, athermal slug, and a thermal well, wherein the at least one thermalmanagement element is arranged completely inside at least one cavity ofthe plurality of cavities and embedded into at least one of the firstmaterial layers that corresponds with the at least one cavity of theplurality of cavities.
 17. A multilayer structure, comprising: at leastone electrical node comprising: a first substrate film defining a cavityand a first material layer arranged to at least partly fill the cavity,and to embed or at least partly cover at least one electrical elementarranged into the cavity; or at least one electrical node strip or sheetcomprising a first substrate film defining a plurality of cavities andat least a corresponding number of first material layers with respect toa number of the plurality of cavities, wherein each of the firstmaterial layers at least partly fills a respective one of the cavitiesand embeds at least one electronic component therein; a host substrate,wherein the at least one electrical node or the at least one electricalnode strip or sheet is arranged on the host substrate, and a molded orcast material layer covering the at least one electrical node or the atleast one electrical node strip or sheet on the host substrate, whereinthe at least one electrical node or the at least one electrical nodestrip or sheet is arranged on the host substrate such that the at leastone electrical element is or elements are between the first substratefilm and the host substrate.
 18. The multilayer structure according toclaim 17, further comprising at least one second electrical elementarranged at on one of the first substrate film on the opposite side ofthe first substrate film with respect to the cavity.